| Item |
Standard capability |
higher capability
|
Roadmap
|
| 2020 |
2022 |
| Layer no. |
28L |
32L |
36L |
40L |
| Board thickness |
≤4mm |
≤6mm |
≤7mm |
≤7mm |
| Pcb size |
≤450*550mm |
550*1200mm |
550*1200mm |
550*1200mm |
| Inner layer copper |
≤3oz |
≤5oz |
≤5oz |
≤5oz |
| Min. Line width/spacing |
Inner layer |
3.5/3.5mil |
3.0/3.0mil |
2.5/2.5mil |
2.0/2.0mil |
| Outer layer |
4/4mil |
4/4mil |
3/4mil |
3/3mil |
| drill |
min driller |
0.20mm |
0.15mm |
0.15mm |
0.15mm |
| Hole tolerance |
±2mill |
±2mill |
±2mill |
±1.5mill |
| backdrill size |
D+8mill |
D+6mill |
D+6mill |
D+4mill |
| Backdril Stub |
2~12mil |
2~10mil |
2~8mil |
2~6mil |
| Micro vias |
1+N+1 |
2+N+2 , Skip Micro-via |
2+N+2 , Skip Micro-via |
2+N+2 , Skip Micro-via |
| Aspect ratio |
≤15: 1 |
20: 1 |
20: 1 |
25: 1 |
| Alignment |
layer misregistration |
<2mil with same core ,or else max is 6mil |
<1mil with same core ,or else max is 5mil |
<1mil with same core ,or else max is 4mil |
<1mil with same core ,or else max is 3.5mil |
| Soldermask open window |
3mil |
2mil |
2mil |
1.5mil |
| POFV |
Through hole |
POFV |
POFV |
POFV、non-POFV |
POFV、non-POFV |
| backdrill |
POFV with double size backdrill |
POFV with double size backdrill |
POFV with double size backdrill |
POFV with double size backdrill |
| Impedance |
≥ 50ohm (inner/outer layer) |
±10% / ±8% |
±8% / ±7% |
±8% / ±7% |
±8% / ±5% |
| < 50ohm |
< 40ohm |
< 30ohm |
< 30ohm |
< 2.50ohm |
| Surface finish |
ENIG, Immersion Tn, Immersion silver,OSP ,gold finger, ENIG+OSP,ENEPIG |
| Insertion loss measurement |
SET2DIL、Delta L |
SET2DIL、TRL、Delta L、AFR |
SET2DIL、TRL、Delta L、AFR |
